"thermosonically" meaning in All languages combined

{
  "etymology_templates": [
    {
      "args": {
        "1": "en",
        "2": "thermosonic",
        "3": "ally"
      },
      "expansion": "thermosonic + -ally",
      "name": "suffix"
    }
  ],
  "etymology_text": "thermosonic + -ally",
  "head_templates": [
    {
      "args": {
        "1": "-"
      },
      "expansion": "thermosonically (not comparable)",
      "name": "en-adv"
    }
  ],
  "lang": "English",
  "lang_code": "en",
  "pos": "adv",
  "senses": [
    {
      "categories": [
        {
          "kind": "other",
          "name": "English entries with incorrect language header",
          "parents": [
            "Entries with incorrect language header",
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          "source": "w"
        },
        {
          "kind": "other",
          "name": "English terms suffixed with -ally",
          "parents": [],
          "source": "w"
        },
        {
          "kind": "other",
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          "parents": [],
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        {
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      "examples": [
        {
          "ref": "1989 January 24, “4,800,178 METHOD OF ELECTROPLATING A COPPER LEAD FRAME WITH COPPER”, in OFFICIAL GAZETTE of the UNITED STATES PATENT AND TRADEMARK OFFICE, volume 1098, number 4, page 1944:",
          "text": "… rinsing said passivated copper tape; bonding a semiconductor device to said tape; and thermosonically bonding gold wires between said tape and said semiconductor device.",
          "type": "quote"
        },
        {
          "ref": "2000, Richard Ulrich, Mohammed Wasef, Jang-hi Im, Phil Garrou, Dan Scheck, “WIREBONDING TO ELECTROLESSLY-METALLIZED COPPER BONDPADS OVER THICK BENZOCLOBUTENE”, in LOW AND HIGH DIELECTRIC CONSTANT MATERIALS: MATERIALS SCIENCE, PROCESSING, AND RELIABILIY ISSUES Procedings of the Fourth International Symposium and THIN FILM MATERIALS FOR ADVANCED PACKAGING TECHNOLOGIES Procedings of the Second International Symposium, The Electrochemical Society, [We have stucied the ability to thermosonically wirebond gold onto Cu/Ni/Au surface metallurgy consisting of 2 μm Cu representing the bondpad followed by 1 to 4 μm electroless Ni and 1 μm Au over 5-20 μm of BCB (CYCLOTENE™) dielectric. page 168]:",
          "text": "We have studied the ability to thermosonically wirebond gold onto Cu/Ni/Au surface metallurgy consisting of 2 μm Cu representing the bondpad followed by 1 to 4 μm electroless Ni and 1 μm Au over 5-20 μm of BCB (CYCLOTENE™) dielectric.",
          "type": "quote"
        },
        {
          "ref": "2025 February 19, Wikipedia contributors, “Compliant bonding”, in English Wikipedia, Wikimedia Foundation:",
          "text": "Thus the beam leaded “chip” eliminated the need to thermosonically bond wires directly onto metallized pads of the fragile silicon chip (as shown in Figure 6).",
          "type": "quote"
        }
      ],
      "glosses": [
        "Involving both heat and ultrasonic energy."
      ],
      "id": "en-thermosonically-en-adv-PM7heMJ6",
      "tags": [
        "not-comparable"
      ]
    }
  ],
  "sounds": [
    {
      "other": "/ˌθɜːrmoʊˈsɒnɪkli/"
    }
  ],
  "word": "thermosonically"
}

{
  "etymology_templates": [
    {
      "args": {
        "1": "en",
        "2": "thermosonic",
        "3": "ally"
      },
      "expansion": "thermosonic + -ally",
      "name": "suffix"
    }
  ],
  "etymology_text": "thermosonic + -ally",
  "head_templates": [
    {
      "args": {
        "1": "-"
      },
      "expansion": "thermosonically (not comparable)",
      "name": "en-adv"
    }
  ],
  "lang": "English",
  "lang_code": "en",
  "pos": "adv",
  "senses": [
    {
      "categories": [
        "English 5-syllable words",
        "English adverbs",
        "English entries with incorrect language header",
        "English lemmas",
        "English terms suffixed with -ally",
        "English terms with IPA pronunciation",
        "English terms with quotations",
        "English uncomparable adverbs",
        "Pages with 1 entry",
        "Pages with entries"
      ],
      "examples": [
        {
          "ref": "1989 January 24, “4,800,178 METHOD OF ELECTROPLATING A COPPER LEAD FRAME WITH COPPER”, in OFFICIAL GAZETTE of the UNITED STATES PATENT AND TRADEMARK OFFICE, volume 1098, number 4, page 1944:",
          "text": "… rinsing said passivated copper tape; bonding a semiconductor device to said tape; and thermosonically bonding gold wires between said tape and said semiconductor device.",
          "type": "quote"
        },
        {
          "ref": "2000, Richard Ulrich, Mohammed Wasef, Jang-hi Im, Phil Garrou, Dan Scheck, “WIREBONDING TO ELECTROLESSLY-METALLIZED COPPER BONDPADS OVER THICK BENZOCLOBUTENE”, in LOW AND HIGH DIELECTRIC CONSTANT MATERIALS: MATERIALS SCIENCE, PROCESSING, AND RELIABILIY ISSUES Procedings of the Fourth International Symposium and THIN FILM MATERIALS FOR ADVANCED PACKAGING TECHNOLOGIES Procedings of the Second International Symposium, The Electrochemical Society, [We have stucied the ability to thermosonically wirebond gold onto Cu/Ni/Au surface metallurgy consisting of 2 μm Cu representing the bondpad followed by 1 to 4 μm electroless Ni and 1 μm Au over 5-20 μm of BCB (CYCLOTENE™) dielectric. page 168]:",
          "text": "We have studied the ability to thermosonically wirebond gold onto Cu/Ni/Au surface metallurgy consisting of 2 μm Cu representing the bondpad followed by 1 to 4 μm electroless Ni and 1 μm Au over 5-20 μm of BCB (CYCLOTENE™) dielectric.",
          "type": "quote"
        },
        {
          "ref": "2025 February 19, Wikipedia contributors, “Compliant bonding”, in English Wikipedia, Wikimedia Foundation:",
          "text": "Thus the beam leaded “chip” eliminated the need to thermosonically bond wires directly onto metallized pads of the fragile silicon chip (as shown in Figure 6).",
          "type": "quote"
        }
      ],
      "glosses": [
        "Involving both heat and ultrasonic energy."
      ],
      "tags": [
        "not-comparable"
      ]
    }
  ],
  "sounds": [
    {
      "other": "/ˌθɜːrmoʊˈsɒnɪkli/"
    }
  ],
  "word": "thermosonically"
}